Aplikimet: Transformer Driver, Rryma - Furnizimi: 1.1mA, Tensioni - Furnizimi: 2.5V ~ 6V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Power Supplies, Rryma - Furnizimi: 2.5mA, Tensioni - Furnizimi: 9.3V ~ 28V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Aplikimet: Energy Harvesting, Tensioni - Furnizimi: 5.7V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 12-UFDFN Exposed Pad,
Aplikimet: Current Sense Amp, Current Switch, Rryma - Furnizimi: 600µA, Tensioni - Furnizimi: 5V ~ 18V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 16-SSOP (0.154", 3.90mm Width),
Aplikimet: Thermoelectric Cooler, Tensioni - Furnizimi: 3V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Aplikimet: Automotive Systems, Tensioni - Furnizimi: 3.7V ~ 28V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Aplikimet: Power Supplies, Rryma - Furnizimi: 2.5mA, Tensioni - Furnizimi: 4.5V ~ 5.5V, Temperatura e punës: 0°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 20-TSSOP (0.173", 4.40mm Width),
Aplikimet: Processor, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-WFQFN Exposed Pad,
Aplikimet: Thermoelectric Cooler, Tensioni - Furnizimi: 2.8V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-LQFP Exposed Pad,
Aplikimet: Handheld/Mobile Devices, OMAP™, Tensioni - Furnizimi: 2.7V ~ 4.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 169-LFBGA,
Aplikimet: Handheld/Mobile Devices, Tensioni - Furnizimi: 2.5V ~ 6V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-WFQFN Exposed Pad,
Aplikimet: Cellular, CDMA Handset, Tensioni - Furnizimi: 3V ~ 5.5V, Lloji i montimit: Surface Mount, Paketa / Rasti: 49-WFBGA, DSBGA,
Aplikimet: Handheld/Mobile Devices, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 247-TFBGA,
Aplikimet: Automotive, Rryma - Furnizimi: 10mA, Tensioni - Furnizimi: 4.7V ~ 36V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Aplikimet: Processor, Rryma - Furnizimi: 95µA, Tensioni - Furnizimi: 5.6V ~ 25V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 20-SOIC (0.295", 7.50mm Width),
Aplikimet: Pump, Valve Controller, Tensioni - Furnizimi: 6V ~ 36V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 64-LQFP Exposed Pad,
Aplikimet: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Tensioni - Furnizimi: 3.8V ~ 7V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-VFQFN Exposed Pad,
Aplikimet: Processor, Rryma - Furnizimi: 500µA, Tensioni - Furnizimi: 9.5V ~ 18V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Through Hole, Paketa / Rasti: 13-SIP Formed Leads,
Aplikimet: Automotive, Rryma - Furnizimi: 5mA, Tensioni - Furnizimi: 5.5V ~ 18V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-BSSOP (0.295", 7.50mm Width),
Aplikimet: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 186-LFBGA,
Aplikimet: Ignition Buffer, Regulator, Rryma - Furnizimi: 300µA, Tensioni - Furnizimi: 9V ~ 18V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Through Hole, Paketa / Rasti: 23-SIP Formed Leads,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 7mA, Tensioni - Furnizimi: 3.5V ~ 28V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-LQFP Exposed Pad,
Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Heating Controller, Tensioni - Furnizimi: 4V ~ 5.5V, Temperatura e punës: -20°C ~ 85°C (TA), Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Lloji i montimit: Through Hole, Paketa / Rasti: 8-DIP (0.300", 7.62mm),
Aplikimet: Hardware Management Controller, Tensioni - Furnizimi: 4.75V ~ 13.2V, Temperatura e punës: 0°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 237-LBGA,
Aplikimet: Handheld/Mobile Devices, OMAP™, Rryma - Furnizimi: 8µA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Wireless Power Receiver, Lloji i montimit: Surface Mount,
Aplikimet: Automotive, Tensioni - Furnizimi: 8V ~ 18V, Temperatura e punës: -20°C ~ 100°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Pulse Generator, Rryma - Furnizimi: 50µA, Tensioni - Furnizimi: 4.75V ~ 11V, Temperatura e punës: -20°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 22-VFLGA,