Aplikimet: Heating Controller, Tensioni - Furnizimi: 3.5V ~ 5.5V, Temperatura e punës: -20°C ~ 85°C (TA), Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Lloji i montimit: Through Hole, Paketa / Rasti: 8-DIP (0.300", 7.62mm),
Aplikimet: Smart Iron Controller, Rryma - Furnizimi: 400µA, Tensioni - Furnizimi: 4.5V ~ 5.5V, Temperatura e punës: -10°C ~ 85°C (TA), Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Smart Iron Controller, Rryma - Furnizimi: 400µA, Tensioni - Furnizimi: 4.5V ~ 5.5V, Temperatura e punës: -10°C ~ 85°C (TA), Lloji i montimit: Through Hole, Paketa / Rasti: 8-DIP (0.300", 7.62mm),
Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Heating Controller, Tensioni - Furnizimi: 3.5V ~ 5.5V, Temperatura e punës: -20°C ~ 85°C (TA), Lloji i montimit: Through Hole, Paketa / Rasti: 8-DIP (0.300", 7.62mm),
Aplikimet: Wireless Power Transmitter, Temperatura e punës: -40°C ~ 85°C,
Aplikimet: Wireless Power Receiver,
Aplikimet: Wireless Power Receiver, Temperatura e punës: -40°C ~ 85°C,
Aplikimet: Wireless Power Receiver, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount,
Aplikimet: Wireless Power Receiver, Temperatura e punës: 0°C ~ 85°C,
Aplikimet: LCD Display, Rryma - Furnizimi: 700µA, Tensioni - Furnizimi: 2.5V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 28-VFQFN Exposed Pad,
Aplikimet: Ground Fault Protection, Rryma - Furnizimi: 19mA, Tensioni - Furnizimi: 22V ~ 30V, Temperatura e punës: -40°C ~ 70°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Processor, Rryma - Furnizimi: 60µA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Handheld/Mobile Devices, OMAP™, Rryma - Furnizimi: 20µA, Tensioni - Furnizimi: 2.5V ~ 4.8V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 155-UFBGA, DSBGA,
Aplikimet: System Basis Chip, Tensioni - Furnizimi: -1.0V ~ 40V, Temperatura e punës: -40°C ~ 150°C (TA), Lloji i montimit: Surface Mount, Paketa / Rasti: 48-LQFP Exposed Pad,
Aplikimet: General Purpose, Supervisor, Sequence, Rryma - Furnizimi: 7.5mA, Tensioni - Furnizimi: 13V ~ 32V, Temperatura e punës: 0°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Aplikimet: Power Supplies, Rryma - Furnizimi: 60mA, Tensioni - Furnizimi: 2.8V ~ 6V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-BSSOP (0.295", 7.50mm Width),
Aplikimet: Overvoltage Protection Controller, Rryma - Furnizimi: 58µA, Tensioni - Furnizimi: 2.8V ~ 28V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 12-UFBGA, WLCSP,
Aplikimet: Automotive Systems, Tensioni - Furnizimi: 3.7V ~ 28V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Aplikimet: Cell Phone, Digital Camera, PDA's, Smartphones, Rryma - Furnizimi: 6.8mA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 49-WFBGA, WLBGA,
Aplikimet: Automotive, Rryma - Furnizimi: 1mA, Tensioni - Furnizimi: 8V ~ 20V, Temperatura e punës: -40°C ~ 150°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 36-BSSOP (0.295", 7.50mm Width) Exposed Pad,
