Aplikimet: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Tensioni - Furnizimi: 3.8V ~ 7V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-VFQFN Exposed Pad,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 4.5mA, Tensioni - Furnizimi: 5.5V ~ 18V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-LQFP,
Aplikimet: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Tensioni - Furnizimi: 3.8V ~ 7V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-VFQFN Exposed Pad,
Aplikimet: Processor, Tensioni - Furnizimi: 2.8V ~ 5.5V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-VFQFN Exposed Pad,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 4.5mA, Tensioni - Furnizimi: 5.5V ~ 27V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-LQFP,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 4.5mA, Tensioni - Furnizimi: 5.5V ~ 27V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-LQFP,
