Përshtatës, Bordet e Breakout | Prototipi, Produktet e fabrikimit | 1

319010351

aksione: 24023

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: QFP, Numri i Pozicioneve: 80, Katran: 0.031" (0.80mm),

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Seeed Technology Co., Ltd

319010053

aksione: 7250

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Numri i Pozicioneve: 6, 8, Katran: 0.026" (0.65mm),

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Seeed Technology Co., Ltd

319010042

aksione: 5042

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Numri i Pozicioneve: 6, 8, Katran: 0.020" (0.50mm),

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Seeed Technology Co., Ltd

319010045

aksione: 4248

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: QFP, Numri i Pozicioneve: 80, Katran: 0.026" (0.65mm),

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Seeed Technology Co., Ltd

319010352

aksione: 23969

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: QFP, Numri i Pozicioneve: 80, Katran: 0.020" (0.50mm),

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Seeed Technology Co., Ltd

319010047

aksione: 7199

Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Numri i Pozicioneve: 6, 8, Katran: 0.020" (0.50mm),

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