Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: TSSOP, Katran: 0.020" (0.50mm), Trashësia e bordit: 0.062" (1.57mm) 1/16",
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: TSSOP,
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC, Trashësia e bordit: 0.062" (1.57mm) 1/16",
Lloji i bordit Proto: SMD to DIP, Paketa e Pranuar: PSOP, SSOP, TSOP, Trashësia e bordit: 0.062" (1.57mm) 1/16",
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: QFP, Trashësia e bordit: 0.062" (1.57mm) 1/16",
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: PLCC, Trashësia e bordit: 0.062" (1.57mm) 1/16",
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: TQFP,
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC,
Lloji i bordit Proto: SMD to Plated Through Hole Board, Paketa e Pranuar: SOIC, Katran: 0.020" (0.50mm), Trashësia e bordit: 0.062" (1.57mm) 1/16",