Aplikimet: Handheld/Mobile Devices, OMAP™, Rryma - Furnizimi: 8µA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 150°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Handheld/Mobile Devices, OMAP™, Rryma - Furnizimi: 8µA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Handheld/Mobile Devices, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 247-TFBGA,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 7mA, Tensioni - Furnizimi: 3.5V ~ 28V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-LQFP Exposed Pad,
Aplikimet: System Basis Chip, Rryma - Furnizimi: 2mA, Tensioni - Furnizimi: 5.5V ~ 28V, Temperatura e punës: -40°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Aplikimet: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 139-TFBGA,
Aplikimet: Automotive, Rryma - Furnizimi: 6mA, Tensioni - Furnizimi: 8V ~ 18V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 16-SOIC (0.154", 3.90mm Width),
Aplikimet: Processor, Rryma - Furnizimi: 95µA, Tensioni - Furnizimi: 5.6V ~ 25V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 20-SOIC (0.295", 7.50mm Width),
Aplikimet: Processor, Rryma - Furnizimi: 95µA, Tensioni - Furnizimi: 5.6V ~ 25V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Electric Heating Systems, Rryma - Furnizimi: 900µA, Tensioni - Furnizimi: -10V ~ -8V, Temperatura e punës: -20°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Heating Controller, Tensioni - Furnizimi: 4V ~ 5.5V, Temperatura e punës: -20°C ~ 85°C (TA), Lloji i montimit: Through Hole, Paketa / Rasti: 8-DIP (0.300", 7.62mm),
Aplikimet: Smart Iron Controller, Rryma - Furnizimi: 400µA, Tensioni - Furnizimi: 4.5V ~ 5.5V, Temperatura e punës: -10°C ~ 85°C (TA), Lloji i montimit: Surface Mount, Paketa / Rasti: 8-SOIC (0.154", 3.90mm Width),
Aplikimet: Transformer Driver, Rryma - Furnizimi: 1.1mA, Tensioni - Furnizimi: 2.5V ~ 6V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width),
Aplikimet: Processor, Tensioni - Furnizimi: 2.6V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-WFQFN Exposed Pad,
Aplikimet: Thermoelectric Cooler, Tensioni - Furnizimi: 3V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 48-WFQFN Exposed Pad,
Aplikimet: Photoflash Capacitor Charger, Xenon, Tensioni - Furnizimi: 2.5V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-WDFN Exposed Pad,
Aplikimet: Automotive, USB Protection, Tensioni - Furnizimi: 4.75V ~ 5.25V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 16-SSOP (0.154", 3.90mm Width),
Aplikimet: Processor, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Automotive, Rryma - Furnizimi: 750mA, Tensioni - Furnizimi: 3V ~ 5.5V, 4V ~ 28V, Temperatura e punës: -40°C ~ 105°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Aplikimet: Medical Ultrasound Imaging, Sonar, Rryma - Furnizimi: 36mA, Tensioni - Furnizimi: 2.7V~ 6V, Temperatura e punës: 0°C ~ 70°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 56-WFQFN Exposed Pad,
Aplikimet: Transformer Driver, Rryma - Furnizimi: 450µA, Tensioni - Furnizimi: 3.3V, 5V, Temperatura e punës: 0°C ~ 70°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width),
Aplikimet: Processor, Rryma - Furnizimi: 10mA, Tensioni - Furnizimi: 4.75V ~ 7.5V, Temperatura e punës: 0°C ~ 125°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 16-VFQFN Exposed Pad,
Aplikimet: Energy Harvesting, Rryma - Furnizimi: 3.8mA, Tensioni - Furnizimi: 80mV ~ 3V, Temperatura e punës: 0°C ~ 70°C, Lloji i montimit: Surface Mount, Paketa / Rasti: Module,
Aplikimet: Wireless Power Receiver, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 99-XFBGA, WLCSP,
Aplikimet: Wireless Power Receiver,
Aplikimet: Avionics Sensor, Low Side Driver, Rryma - Furnizimi: 15mA, Tensioni - Furnizimi: 3V ~ 3.6V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 44-BQFP,
Aplikimet: Processor, Rryma - Furnizimi: 60µA, Tensioni - Furnizimi: 2.7V ~ 5.5V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 40-WFQFN Exposed Pad,
Aplikimet: Powerline Data Access, Rryma - Furnizimi: 28mA, Tensioni - Furnizimi: 4.75V ~ 5.25V, Temperatura e punës: -40°C ~ 85°C, Lloji i montimit: Surface Mount, Paketa / Rasti: 16-SOIC (0.295", 7.50mm Width),
